Mitsubishi Electric Corporation announced it will launch a transfer-mold-type, super-mini dual inline package intelligent power module (DIPIPM) primarily used for inverter drive systems of small-capacity motors in refrigerators and other consumer appliances. The module uses a metal oxide semiconductor field effect transistor (MOSFET) switching device featuring low power-on voltage in low current regions. Sales will begin on March 1.
With optimized low-loss-drive ICs and a high-heat dissipation design, the module will help to reduce power consumption, advance miniaturization and lower the cost of inverter systems for small-capacity motor drive applications.
Product Features
Reduced power consumption in small-capacity inverter systems*
– Power-on voltage in low current regions is reduced by about 60% compared to Mitsubishi Electric’s existing “PS219B2” DIPIPM at 0.5A and 25 degrees Celsius, by employing a MOSFET switching device.
– Reduction of recovered-power loss by optimizing the MOSFET process.
– Reduction of IC power loss by optimizing the control IC.
High reliability through high-heat dissipation structure
Suppression of channel temperature rise by reducing power loss of switching device and applying a high-heat dissipation insulation sheet.
Cost reduction and miniaturization of final product
Facilitation of thermal radiation via the high-heat dissipation design.
Reduction of external components thanks to built-in bootstrap diode (BSD) with current limiting resistor.
