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标题: CADENCE的元件封装中,手工做封装都包括哪些方面的呢?谢谢. [打印本页]

作者: ngbngb    时间: 2007-1-11 10:32     标题: CADENCE的元件封装中,手工做封装都包括哪些方面的呢?谢谢.

在CADENCE中,手工做个元件封装时,包括哪些方面的呢?比如实体,丝印层,装配层等等,我想知道具体都包括哪些?从焊盘实体,再到丝印层,再到装配层,下面还包括哪些呢?谢谢.
作者: 一通百通    时间: 2007-1-11 13:58

以0805以例,有如下信息:(找一个Symbol看看,也可以用向导做)

LISTING: 10 element(s)

Item 1  < STAND-ALONE PIN >       

       class         PIN

  location-xy:   (-45.00 0.00)

  pin number:   1

  not on a net

  padstack name:   SMD60REC50

  padstack defined only on TOP
  padstack rotation:   0.000  degrees

  Number of connections: 0
  ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

Item 2  < FILLED RECTANGLE >       

       class         PACKAGE GEOMETRY
       subclass      PLACE_BOUND_TOP

            xy-lower          xy-upper
  Rectangle Top:    (-85.00 35.00) (85.00 35.00)
  Rectangle Bottom: (-85.00 -35.00) (85.00 -35.00)

  Height: 70.00 mils
  Width:  170.00 mils
  Area:  0.0119  (sq in)

  rotation:  0.000  degrees
  ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

Item 3     < RECTANGLE >          

       class         PACKAGE GEOMETRY
       subclass      ASSEMBLY_TOP

  Rectangle Top:    (-85.00 35.00) (85.00 35.00)
  Rectangle Bottom: (-85.00 -35.00) (85.00 -35.00)

  Height: 70.00 mils
  Width:  170.00 mils
  Area:  0.0119  (sq in)


  rotation:  0.000  degrees
  line font: Solid
 
  ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

Item 4        < LINE >             

       class         PACKAGE GEOMETRY
       subclass      SILKSCREEN_TOP

segment:xy (-85.00 35.00) xy (-85.00 -35.00) width (7.00) font (Solid)
  ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

Item 5        < LINE >             

       class         PACKAGE GEOMETRY
       subclass      SILKSCREEN_TOP

segment:xy (-85.00 -35.00) xy (85.00 -35.00) width (7.00) font (Solid)
  ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

Item 6        < LINE >             

       class         PACKAGE GEOMETRY
       subclass      SILKSCREEN_TOP

segment:xy (85.00 35.00) xy (-85.00 35.00) width (7.00) font (Solid)
  ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

Item 7        < TEXT >             

       class         REF DES
       subclass      ASSEMBLY_TOP

  TEXT CONTENTS:
    "R*"
 
    origin-xy:    (-75.00 50.00)
    rotation:  0.000  degrees
    not_mirrored
    justification:    left

  TEXT_BLOCK# 2
  font:            ANSI
  height:          31.00
  width:           23.00
  photoplot width: 0.00
  spacing:         8.00
  line spacing:    39.00
  ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

Item 8        < TEXT >             

       class         REF DES
       subclass      SILKSCREEN_TOP

  TEXT CONTENTS:
    "R*"
 
    origin-xy:    (-75.00 50.00)
    rotation:  0.000  degrees
    not_mirrored
    justification:    left

  TEXT_BLOCK# 2
  font:            ANSI
  height:          31.00
  width:           23.00
  photoplot width: 0.00
  spacing:         8.00
  line spacing:    39.00
  ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

Item 9  < STAND-ALONE PIN >       

       class         PIN

  location-xy:   (45.00 0.00)

  pin number:   2

  not on a net

  padstack name:   SMD60REC50

  padstack defined only on TOP
  padstack rotation:   0.000  degrees

  Number of connections: 0
  ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

Item 10       < LINE >             

       class         PACKAGE GEOMETRY
       subclass      SILKSCREEN_TOP

segment:xy (85.00 -35.00) xy (85.00 35.00) width (7.00) font (Solid)

  ~ ~ ~ ~ ~ ~ ~end-of-file~ ~ ~ ~ ~ ~ ~


作者: ngbngb    时间: 2007-1-12 11:15

首先谢谢一能大哥的解答,

我用向导做过封装,也做了PCB,有时会遇到一些特殊的封装器件,要自己动手做的.所以才问这个问题,有时做了两上焊盘后,下面加实体,下面就不知道该做什么了,一直这样的困惑中,


作者: linxy5596    时间: 2011-12-3 14:47

对我也是这样!很郁闷了!




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