子阵单元轮廓 | 基板上的AMC | 盖板上的FSS | 馈电 贴片 | 寄生 贴片 |
R=45.0 | PAMC=5.9 | PFSS=5.3 | lf =9.7 | lp =9.1 |
h =1 | d1,2,3=2.8 | e1,2=4.8 | wf=7.0 | wp =8.0 |
hc=16.3 | d4 =3.0 | e3 =4.7 | fy =8.7 | lup=11.1 |
hp=0.8 | d5 =3.2 | e4,5,6=4.6 | dslot=3.2 | wup=18.0 |
e7 =4.5 | ls =1.1 | doffset=1.4 | ||
e8 =4.3 | ws=4.0 |
性能 | 仿真 | 测试 |
Gpeak (dBi) | 22.87 (9.6 GHz) | 22.51 (9.7 GHz) |
hpeak (%) | 37.7 | 34.7 |
BWcomm(GHz) | 9.38~10.33 (9.63 %) | 9.49~10.31 (8.28 %) |
BWVSWR(GHz) | 9.33~10.42 | 8.99~11.53 |
BWGain(GHz) | 9.38~10.33 | 9.46~10.73 |
BWSLL (GHz) | 9.36~10.48 | 9.49~10.31 |
HPBW (°) | 8.1~8.5 | 8.4~8.8 |
SLL (dB) | -18 | -15 |
X-PL (dB) | / | < - 30.0 dB |
* HPBW-半功率主瓣宽度;X-PL-主瓣内交叉极化电平 |
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