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用P&E的USB－ML－12的BDM头调试自己做的S12XDP512（112管脚）的板子，CW4.5，按向导生成一个点灯的工程，只选PE ML/ CyclonePro（不选Full chip simulation），在make后debug时，出现第一个错误，点“确定”，依次出现上述几个窗口，命令行显示“BDM speed problem”。
在网上查询时，有人提示是晶振不起振或振幅不够，查Eclk端输出，确实幅值偏低，后在晶振两端并联10M电阻后，Eclk两端测量波形，幅值为5V，频率为8M。但此时仍出现同第一页图示相同的错误。
BDM电路板上晶振为12M，自己板子上晶振为16M。
跳线设置如下：（MODEC/B/A为100时，是普通单片模式）
MODEA空；（S12XDP512的112封装无此管脚）
MODEB空；（S12XDP512的112封装无此管脚）
MODEC通过3.3k电阻上拉到VCC；
XCLKS（PE7）通过3.3k电阻上拉到VCC；
VREGEN通过3.3k电阻上拉到VCC；
晶振加并联电阻前命令行的提示：
executing C_layout.hwl
!OPEN source 0 0 60 39
NO CONNECTION
!Source < attributes MARKS off
!OPEN assembly 60 0 40 31
!Assembly < attributes ADR on,CODE off,ABSADR on,SYMB off,TOPPC 0xF88C
!OPEN procedure 0 39 60 17
!Procedure < attributes VALUES on,TYPES off
!OPEN register 60 31 40 25
!Register < attributes FORMAT AUTO,COMPLEMENT None
!OPEN memory 60 56 40 22
!Memory < attributes FORMAT hex,COMPLEMENT None,WORD 1,ASC on,ADR on,ADDRESS 0x80
!OPEN data 0 56 60 22
!Data:1 < attributes SCOPE global,COMPLEMENT None,FORMAT Symb,MODE automatic,UPDATERATE 10,NAMEWIDTH 16
!OPEN data 0 78 60 22
!Data:2 < attributes SCOPE local,COMPLEMENT None,FORMAT Symb,MODE automatic,UPDATERATE 10,NAMEWIDTH 16
!OPEN command 60 78 40 22
!Command < attributes CACHESIZE 1000
!bckcolor 50331647
!font 'Courier New' 9 BLACK
!AUTOSIZE on
!ACTIVATE Data:2 Command Procedure Data:1 Source Register Assembly Memory
done C_layout.hwl
Loading Target ...
SETCOMM DRIVER NOPROTOCOL NOPERIODICAL ""
SETCOMM COMPORT NONE
Error: The debugger is currently not able to run
due to loss of contact with hardware.
BDM speed problem
in>load
Error: there is currently no Connection selected
in>
晶振加并联电阻后命令行的提示：
executing C_layout.hwl
!OPEN source 0 0 60 39
NO CONNECTION
!Source < attributes MARKS off
!OPEN assembly 60 0 40 31
!Assembly < attributes ADR on,CODE off,ABSADR on,SYMB off,TOPPC 0xF88C
!OPEN procedure 0 39 60 17
!Procedure < attributes VALUES on,TYPES off
!OPEN register 60 31 40 25
!Register < attributes FORMAT AUTO,COMPLEMENT None
!OPEN memory 60 56 40 22
!Memory < attributes FORMAT hex,COMPLEMENT None,WORD 1,ASC on,ADR on,ADDRESS 0x80
!OPEN data 0 56 60 22
!Data:1 < attributes SCOPE global,COMPLEMENT None,FORMAT Symb,MODE automatic,UPDATERATE 10,NAMEWIDTH 16
!OPEN data 0 78 60 22
!Data:2 < attributes SCOPE local,COMPLEMENT None,FORMAT Symb,MODE automatic,UPDATERATE 10,NAMEWIDTH 16
!OPEN command 60 78 40 22
!Command < attributes CACHESIZE 1000
!bckcolor 50331647
!font 'Courier New' 9 BLACK
!AUTOSIZE on
!ACTIVATE Data:2 Command Procedure Data:1 Source Register Assembly Memory
done C_layout.hwl
Loading Target ...
Error: The debugger is currently not able to run
due to loss of contact with hardware.
BDM speed problem
in>
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